HDI technology up to 5 lamination cycles

  • Min laser hole size is 4mil (100 microns)
  • Min landing pad size 10mil (254 microns)

Hi-Q is proud to say yes to a Broad Range of Technologies.  Our commitment to R & D and continued investment in equipment and people ensure robust solutions for our valued customers. The commitment to saying yes has not only led us to higher layer counts in through-hole technology, it has lead us to say yes to advanced and emerging technologies.  We now routinely help design and manufacture High Density Interconnect (HDI) product.


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